ELECTRODEPOSITION OF ZN–NI ALLOY COATINGS ON ALUMINIUM SUBSTRATE: INFLUENCE OF DEPOSITION PARAMETERS ON ADHESION STRENGTH
DOI:
https://doi.org/10.35631/IJIREV.826022Keywords:
Aluminium Substrate, Adhesion, Coating, ElectrodepositionAbstract
Aluminium is widely used in various industrial and engineering applications due to its lightweight nature, high electrical and thermal conductivity, good mechanical strength, and excellent corrosion resistance, making it a preferred material in the automotive, aerospace, marine, and electronic industries. However, the formation of a natural oxide layer on aluminium surfaces often results in poor coating adhesion and reduced surface durability, leading to coating peel and weak interfacial bonding between the deposited metal coating and the substrate. This study aims to deposit zinc-nickel (Zn–Ni) alloy coatings onto aluminium substrates using a three-electrode electrochemical system to investigate the effects of deposition parameters on adhesion strength. Prior to deposition, the substrates were treated under zincate treatment to improve adhesion. The electrodeposition process was conducted at different parameters deposition times (10−20 min), temperatures (25–60 °C), and applied potential (−1.1 to −1.5 V). Electrochemical behaviour was analysed using cyclic voltammetry (CV), while coating adhesion was evaluated using the tape test method. The results revealed that deposition parameters significantly affected the coating performance. Higher temperature enhanced coating adhesion, with the strongest adhesion obtained at 60 °C. Shorter deposition time produced better adhesion compared to longer deposition periods, while an applied voltage of −1.3 V yielded the optimum adhesion strength. These findings demonstrate that optimization of electrodeposition parameters is essential for producing strongly adhered Zn–Ni coatings on aluminium substrates, thereby improving coating reliability and extending the potential application of aluminium components in demanding industrial environments.
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