CLEANROOM OPTIMISATION OF INLET-OUTLET CONFIGURATION AT VARIOUS ACH FOR PARTICLE DISPERSION IN ISO CLASS 5 SEMICONDUCTOR CLEANROOM STANDARD

Authors

  • Zharif Samsudin Centre of Mechanical Engineering Studies, College of Engineering, Universiti Teknologi MARA Cawangan Pulau Pinang, 13500 Permatang Pauh, Penang, Malaysia https://orcid.org/0009-0006-6175-2136
  • Sh Mohd Firdaus Sh Abdul Nasir Advanced Mechanics Research Group, Centre of Mechanical Engineering Studies, College of Engineering, Universiti Teknologi MARA Cawangan Pulau Pinang, 13500 Permatang Pauh, Penang, Malaysia https://orcid.org/0000-0002-9681-7829
  • Hazimi Ismail Advanced Mechanics Research Group, Centre of Mechanical Engineering Studies, College of Engineering, Universiti Teknologi MARA Cawangan Pulau Pinang, 13500 Permatang Pauh, Penang, Malaysia https://orcid.org/0009-0005-0477-4681

DOI:

https://doi.org/10.35631/IJIREV.825015

Keywords:

Airflow, ANOVA, CFD Analysis, Cleanroom, Optimization, Taguchi Method

Abstract

The performance of modular cleanrooms is highly dependent on effective airflow distribution and thermal control to minimize contamination and ensure product quality. This study investigates the influence of inlet–outlet configuration and operating parameters on airflow and temperature distribution inside a modular semiconductor cleanroom. Computational Fluid Dynamics (CFD) simulations were conducted to evaluate airflow vector patterns, mean air velocity, and temperature contours at different cross-sectional and working height levels. ANSYS Fluent was used for CFD simulation. Four key parameters, namely inlet size (number of FFUs), outlet size, inlet air temperature, and inlet air velocity, were optimized using the Taguchi method. Signal-to-noise (S/N) ratio analysis based on the larger-the-better criterion was employed to identify the optimal parameter levels for maximizing mean air velocity, while analysis of variance (ANOVA) was used to determine the contribution of each parameter. The results indicate that inlet air velocity is the most significant factor, contributing 56.16% to airflow performance, followed by inlet size, outlet size, and inlet air temperature. The optimal operating condition was identified as 6 FFU, a combined outlet configuration of two large outlets, size (1090 × 1096 mm) and one small outlet, size (534 × 1096 mm), an inlet air temperature of 294 K, and an inlet air velocity of 0.4 m/s. Under the optimal condition, the CFD predicted mean air velocity was 0.44 m/s, which showed good agreement with the experimental result of 0.45 m/s, with a deviation of approximately 2%. The optimized configuration demonstrates improved airflow uniformity and stable temperature distribution at the working height level, confirming the reliability of the proposed optimization framework. This study provides a practical framework for optimizing cleanroom airflow design by identifying the optimal combination of FFU number, inlet velocity, and outlet configuration to improve airflow uniformity, reduce contamination risk, and enhance energy efficiency in ISO Class 5 cleanrooms.

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Published

2026-06-22

How to Cite

Samsudin, Z., Nasir, S. M. F. S. A., & Ismail, H. (2026). CLEANROOM OPTIMISATION OF INLET-OUTLET CONFIGURATION AT VARIOUS ACH FOR PARTICLE DISPERSION IN ISO CLASS 5 SEMICONDUCTOR CLEANROOM STANDARD. INTERNATIONAL JOURNAL OF INNOVATION AND INDUSTRIAL REVOLUTION (IJIREV), 8(25), 253–263. https://doi.org/10.35631/IJIREV.825015