THE FUTURE WORKFORCE: PREPARING STUDENTS FOR CAREERS IN ELECTRONIC PACKAGING MATERIALS

Authors

  • A. Atiqah Universiti Kebangsaan Malaysia
  • Azman Jalar Universiti Kebangsaan Malaysia
  • Maria Abu Bakar Universiti Kebangsaan Malaysia
  • Raihana Bahru Universiti Kebangsaan Malaysia
  • M.N.M Ansari Universiti Tenaga Nasional

Keywords:

Electronic Packaging Materials, Skills Development, Educational Strategies, Miniaturization, Innovation, Scientific Principles, Hands-On Learning, Project-Based Learning

Abstract

The miniaturization and complexity of electronic devices are driving the demand for innovative electronic packaging materials. However, the current workforce may not be fully prepared for the specific skillset required in this evolving field. This paper explores the crucial role of electronic packaging materials and the knowledge, and skills needed for success in this industry.  We propose educational strategies that integrate scientific principles, hands-on activities, and project-based learning to prepare students for careers in electronic packaging materials. The paper acknowledges potential challenges but emphasizes the exciting opportunities for educators and stakeholders to equip the future workforce with the necessary tools for technological advancements in electronics.

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Published

30-06-2024

How to Cite

A. Atiqah, Azman Jalar, Maria Abu Bakar, Raihana Bahru, & M.N.M Ansari. (2024). THE FUTURE WORKFORCE: PREPARING STUDENTS FOR CAREERS IN ELECTRONIC PACKAGING MATERIALS. INTERNATIONAL JOURNAL OF MODERN EDUCATION (IJMOE), 6(21). Retrieved from https://gaexcellence.com/ijmoe/article/view/620